💡 Tips: Semiconductor Design & Manufacturing News and Articles - EDN

Susan Nordyk July 22, 2026 0

Rapidus, Cadence partner on agentic SoC AI

Rapidus and Cadence are collaborating to advance agentic AI for advanced SoC design and accelerate design turnaround Continue Reading...

Susan Nordyk July 18, 2025 0

Product Product Brief

Foundry PDK drives reliable automotive chip design

SK keyfoundry, in collaboration with Siemens EDA Korea, has introduced a 130-nm automotive PDK compatible with Calibre PERC Continue Reading...

Susan Nordyk June 19, 2025 0

Product Product Brief

Siemens certifies EDA tools for Samsung nodes

Siemens expands Samsung Foundry collaboration, certifying more EDA tools for Samsung’s most advanced process Continue Reading...

Susan Nordyk May 29, 2025 0

Product Product Brief

Dry film photoresist enables fine circuit formation

Asahi Kasei has developed the Sunfort TA series of dry film photoresist for next-gen semiconductor packages requiring fine circuit Continue Reading...

EDN Staff April 29, 2025 0

Blogs Tales from the Cube

Tell us your Tale!

We welcome engineers to share their stories, solving challenges relating to a personal project, a contract, or a corporate design Continue Reading...

Michael Munsey, Siemens VP of Electronics & Semiconductors April 8, 2025 0

Analysis IC Designer's Corner

Semiconductor industry strategy 2025: Semiconductors at the heart of software-defined products

The semiconductor industry must rely comprehensive digital twins and adopt collaborations to partner both inside and outside of the Continue Reading...

Brian Dipert December 17, 2024 0

Blogs Brian's Brain Future Tech

2025: A technology forecast for the year ahead

Elections, geopolitical tensions and AI…oh my! Read on for our intrepid engineer’s latest set of predictions (or, at minimum, topics for your particular attention) for the year(s) to Continue Reading...

Susan Nordyk November 1, 2024 0

Product Product Brief

Infineon shrinks silicon wafer thickness

With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the Continue Reading...

Susan Nordyk September 12, 2024 0

Product Product Brief

Faraday streamlines chiplet integration

Faraday has unveiled an advanced packaging service that simplifies chiplet integration by coordinating various vendors and chiplet Continue Reading...